RoHS Compliance of SMD Components for Pb-free Soldering

KEKO VARICON introduced RoHS compliant SMD ceramic body components with barrier type end terminations suitable for Pb-free reflow soldering according to JEDEC standard J-STD-020C. These components encompass :

  • varicons - MLV Series ZV, AV, AVY, ZVE, ZVX, ZVY and DV
  • capacitors - MLC Series C
  • dual function varicons - Series MV and OV.

 

Type Designation

Letter N at the end of type designation us used

ZVE 14 S 0603 N R1
ZV 14 K 0805 121 N R1
AV 20 K 1812 801 N R1
ZVX 30 S 1206 400 N R1
DV 130 K 3225 N R1
C 150 nF K X7R 631 2220 N R1
MV 20 K 105 MZ 1210 251 N R1
OV 30 K 155 MZ 1812 801 N R1

 

Labeling

All RoHS compliant SMD components are designated :

  • with ‘RoHS Compliant’ in Order Confirmation
  • with ‘RoHS Compliant’ in Dispatch Note
  • with yellow adhesive tape with inscription ‘Pb-free’ on the package unit and outer boxes

 

Smolderability and Resistance to Soldering Heat

  • reflow soldering test according to JEDEC standard J-STD-020C for Pb-free solders and
  • soldering test by dipping according to IEC 60068-2 for Pb-free solders.

 

Pb-free Reflow Soldering Profile Recommendations

Recommended soldering profiles for all above components are in accordance with JEDEC standard curves (J-STD-020C) and therefore compatible with existing SnPb reflow process and new Pb-free reflow process.

Soldering Conditions


Solder Material Pb free ( SnAgCu or SnCu with melting point at 217 oC) or Sn62 / 36 Pb / 2 Ag ones
Flux Non-activated (R), flux whenever possible Mildly activated (RMA) fluxes of class L3CN; class ORLO
Solder paste thickness 100 – 300 µm
Soldering Profile Tpeak < 250 °C, time at T > 217 °C not longer than 40 s
Recommended peak soldering temperature 235 +/-5 °C

 

Pad size


Size L (mm) W (mm) A (mm) B (mm) C (mm) D (mm)
0603  1.6 +/-0.20  0.8 +/-0.10 1.0 1.0 0.6 2.6
0805  2.0 +/-0.20  1.25 +/-0.15 1.4 1.2 1.0 3.4
1206  3.2 +/-0.30  1.6 +/-0.20 1.8 1.2 2.1 4.5
1210  3.2 +/-0.30  2.5 +/-0.25 2.8 1.2 2.1 4.5
1812  4.5 +/-0.35  3.2 +/-0.30 3.6 1.5 3.0 6.0
2220  5.7 +/-0.40  5.0 +/-0.40 5.5 1.5 4.2 7.2
3225  8.0 +/-0.50  6.3 +/-0.40 6.8 1.5 6.5 9.5
4032  10.0 +/-0.50  8.0 +/-0.40 6.8 1.5 8.7 11.7

 

Soldering Meniscus Size


Chip 0603, 0805, 1206
Chip 1210, 1812, 2220
 
 

Soldering Conditions


 

 

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